Multiprotocol-capable IO-Link master for scalable automation solutions

Raising IO-Link integration to a new level

The black IO-Link masters of the AutomationLine represent a new generation of decentralised automation solutions. They enable high-performance, versatile IO-Link communication while reducing engineering effort and offering flexible fieldbus connectivity.

Robustness for decentralised field applications

The glass-fibre reinforced plastic housing and the fully potted printed circuit board ensure high resistance. With an IP67 protection rating and a temperature range of –40...70 °C, the devices are well-suited for demanding industrial environments.

Flexible I/O configuration

Thanks to the optimised device architecture, up to 16 digital inputs and 16 digital outputs can be flexibly configured and operated via 8 IO-Link ports. Each port supports IO-Link class A and B and enables the switching of high loads.

High current rating for actuators

With a current rating of up to 2 A per output, the IO-Link masters are ideally suited for applications involving powerful actuators. Typical areas of application include conveyor technology and intralogistics, for example for the direct control of motorised rollers, conveyor drives, diverters or stoppers.

Efficient energy supply and simple networking

The common ground concept (GND US = GND UA, without electrical separation) enables simple and flexible port configuration. Inputs are always supplied from US, while outputs are always supplied from UA. This results in a compact and costefficient device design. The integrated daisy-chain function allows easy voltage supply to multiple IO-Link masters and significantly reduces wiring effort in the field.

Multiprotocol-capable for flexible system concepts

Thanks to the integrated multiprotocol interface, the IO-Link masters of the AutomationLine can be easily integrated into different fieldbus architectures. This supports standardisation in mechanical and plant engineering, reduces type versions and sustainably minimises engineering effort.