Thin film tip technology

This ifm design uses a revolutionary process that metallically bonds the RTD element directly onto the copper-plated inner wall of the probe tip. This creates very low thermal mass with a direct metallic bond for optimal heat transfer. The metallic bond technology eliminates all polymer parts allowing the sensor to be used at higher temperatures. Additionally the tip construction offers response speeds twice as fast as our already fast thin film design.

The metallic bonded construction is great for:

• UHT (Ultra High Temperature) pasteurization processes
• HTST (High Temperature Short Time) pasteurization processes
• SIP (Steam-in-Place) measurement
• Continuous processes where fast reaction speed and critical temperature measurement is required