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3D Image Sensor Wins Control Engineering's 2010 Engineers' Choice Award |
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ifm's 3D Image Sensor Wins 2010 Control Engineering Award
ifm’s 3D Image Sensor was awarded Control Engineerings 2010 Engineers’ Choice Award in the machine vision category. Control Engineering is a leading technical publication and resource for engineers. Their annual award recognizes technological advancement, service to the industry and market impact. Winners were chosen by print and online subscribers of the magazine.
ifm's 3D Image Sensor
ifm's 3D Image Sensor is designed to evaluate size, shape and level in material handling applications. The sensor's innovative technology provides critical information in applications such as palletzing and de-palletizing, material handling, bulk level of materials/food products and intelligent routing/sorting.
The compact sensor uses time-of-flight distance measurement and photonic mixer device technology to identify an object in the sensor‘s field of view. An integrated 64 x 48 pixel array – in which each pixel represents a time of flight measurement – defines the field of view for the sensor.
The sensor's receiver element is a System-on-Chip design. The complete sensor element and electronics are built on a 0.25 mm square silicon chip which reduces the size of the sensor and its cost.
List price for the 3D image sensor is $1450 (U.S.) which is a benchmark in the industry. Systems such as LIDAR, stereo-vision, and long-range radars are typically 300-400% higher in cost compared to the ifm 3D image sensor.
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